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The RSS-210-S Reflow Solder System is a very compact and easy useable tool for the use in laboratories and clean rooms as table top unit. The chamber is vacuum sealed and equipped with a viewing window. This allows the view control of the soldering process. The unit is standard equipped with a Mass Flow Controller for the process gas.
The reflow solder system is perfect for the following applications:
- flux-less soldering
- flip chip process
- adhesive bonding
- solder bump reflowing
- encapsulation of housings
- soldering of power devices
- heat treatment of semiconductor wafers
- prototype development
- quality control
Technical Data:
- heated area: 210 mm x 210 mm (= model RSS-110-S)
- chamber height: 60 mm (optional up to 80 mm)
- viewing window with 60 mm dia.
- Mass Flow controller for Nitrogen (5 nlm)
- vacuum atmosphere up to 10exp.-3 hPa (KF16 connector)
- temperature up to 400 °C (optional up to 500 °C)
- ramp up rate: better 240 K/minute
- ramp down rate: better 120 K/minute
- SIMATIC© process control with 50 programs and 50 steps each
- 7″ touch panel
- water cooled chamber (controlled and watched)
- electrical connection type: 230V, 9 kW or 115V, 7 kW
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UniTemp – your partner for all kind of thermal processes
We develop and sell equipment for microelectronics. Our main focus is based on thermic process engineering. UniTemp combines the technical, ergonomical and economical function with perfect harmony in technics and design to achieve best quality.
All UniTemp products are developed and manufactured in-house (including software, based on SIMATIC© controller . In 2017 we established a mechanical manufacturing area with a 5-axis-CNC machine and a water cutting system. In 2019 we added a coating machine for surface treatment. Therefore we are very flexible in adapting our standard equipment according to special requirements.